Thermal Interface Management (Package Attach): Used as a secondary interconnect method for large area sintering of packaged modules directly onto heatsinks or cold plates, maximizing thermal dissipation and reducing thermal impedance.
Sintering technology is now expanding its boundaries to a pure thermal interface connection on large heatsinks and cold plates.
Thanks to its spacious sintering tools, AMX manages this process with numerous customers worldwide — from laboratory prototyping to full-scale mass production.
