Pressure sintering (silver sintering or in the next future copper sintering too) is a die attach heat treatment process applied to a powdered material in order to give it higher strength, integrity and conductivity.
The InLine X-SAM is a new system designed for quality control in power electronics industries. A non-destructive inspection able to simplify the manufacturing process.
P200 W Series is a full-automatic flat press system able to laminate wafers of different dimensions and thickness for high performance die attach applications.
Core application involving the bonding of SiC/IGBT/MOSFET dies to substrates (DBC or AMB). It supports the simultaneous sintering of diverse components (e.g., NTC thermistors, IGBR resistors, clips, spacers, and pillars) within a single production cycle.
Clip sintering, Cu foil and other component on top of die top side.
An AMX innovative process
Forming complex multi-layered 3D structures where the entire package, including the dies, sensors, frames, and the second DBC on top, is sintered to optimize bi-directional heat dissipation.
A high trending process
Used in front-end, mid-end, and back-end processes, enabling high-performance and significantly improving time to market.
Località Bolina, 1D/1E - 25085 Gavardo (BS) - Italy
info@amx-automatrix.it
Our headquarters are located in Località Bolina, 1D/1E, 25085 Gavardo (BS) Italy.
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