Applications

The increasing demand for components characterized by high power density and the shift towards Wide Bandgap (WBG) semiconductors, such as the next generation of IGBT (Si), Silicon Carbide (SiC) and Gallium Nitride (GaN), requires the use of robust and reliable interconnection technologies. This necessity extends across critical industrial sectors beyond automotive, including railway traction systems (public transport), aerospace and defense, energy transfer systems GRID (UPS, Solar, Wind), and high-frequency communication infrastructures such as 5G and high-performance computing (HPC).
Datacenters and AI applications are also moving in this direction, driven by the persistent technical requirement to increase power density (W/m3) and maximize system efficiency. To ensure the performance and reliability demanded by these harsh environments, pressure sintering has emerged as the industry's preferred die attach solution

Pressure sintering (PS) is a heat treatment process applying simultaneous heat and external uniaxial pressure (typically ranging from 5 MPa to 40 MPa) to metallic particle pastes (Silver/Copper). This technique is essential for achieving reliable die attach solutions capable of continuous operation at junction temperatures exceeding 200°C. The application of pressure drives densification, critically reducing residual porosity, often below 10%. This results in a superior bulk metallic microstructure guaranteeing exceptional thermal conductivity (e.g., sintered Ag ∼300 W/(m⋅K)) and low electrical resistivity (∼2 μΩ⋅cm).