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An AMX classic process
Years of experience have enabled our specialist to develop refined skills in managing these applications.
Thanks to this know-how, AMX is able to provide comprehensive support throughout the entire assembly process.
Main process workflow is:
AMX is also experienced in assembly and sintering of:
Contact us for specific process development and testing support.
Thanks to this know-how, AMX is able to provide comprehensive support throughout the entire assembly process.
Main process workflow is:
- Plasma cleaning of substrates and die backside
- Stencil printing on substrate with custom stencil (3D stencil printing available)
- Drying in a nitrogen (N₂) oven
- Pick and place of dies over paste using hot tacking process to keep the dies in position
- Sintering in N₂ atmosphere using our Micropunch system or flat tool with buffer materials
- Scanning Acoustic Microscopy (SAM) analysis
- Shear test analysis
AMX is also experienced in assembly and sintering of:
- Spacers
- Gate resistors
- NTC
- Metallized piezoelectric sensors
- Lead frames
Contact us for specific process development and testing support.
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